SOLUM and Infineon have signed an MoU to expand collaboration on high-voltage DC power solutions for AI data centers. The agreement covers intermediate bus converters, battery backup units, and power supply units, targeting the industry shift toward 800V HVDC architectures.
Overview
SOLUM Co., Ltd. (KRX: 248070) announced on Nov. 5, 2026, that it has signed a Memorandum of Understanding with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) to strengthen their existing collaboration on high-voltage direct current power solutions for AI data centers. The agreement covers intermediate bus converters, battery backup units and power supply units. It also places the partnership within the industry’s shift toward 800 Vdc rack power architectures, which are intended to improve conversion efficiency and reliability as AI computing loads rise.
Scope of the MoU
Under the MoU, Infineon will work with SOLUM from the early stages of relevant projects to review suitable technologies and product solutions. Infineon will provide reference designs and technical support, drawing on its silicon, silicon carbide and gallium nitride power semiconductors and control solutions. SOLUM will apply its server power design and manufacturing capabilities to develop AI data center power products and pursue application opportunities with global customers. The companies also plan regular technical dialogue on next-generation developments. The three named applications—IBCs, BBUs and PSUs—cover distinct functions in a server rack power chain, from intermediate voltage conversion to backup power and primary power supply.
800 Vdc Rack Architecture and the 26 kW BBU Converter
At the Infineon-SOLUM Collaboration Tech Day, held alongside the signing at SOLUM’s SolSquare campus in Yongin, SOLUM showcased AI data center power solutions incorporating Infineon technologies. The featured product was a 26 kW-class BBU DC/DC converter for 800 Vdc rack power architectures, designed to support continuity of AI server operations during momentary power interruptions. The module uses Infineon CoolSiC™ MOSFETs, EiceDRIVER™ gate drivers and PSOC™ digital power controllers. SOLUM is developing it with a target peak efficiency of more than 98.5%, with mass production targeted for 2027. The efficiency target matters because backup conversion stages can otherwise add losses to an already power-intensive rack architecture.
Semiconductor Technology and Design Collaboration
Infineon’s contribution spans silicon, SiC and GaN power semiconductors plus control solutions, giving SOLUM multiple technology options as it matches devices to converter requirements. The 26 kW-class BBU design illustrates this approach: CoolSiC™ MOSFETs address the high-voltage conversion stage, EiceDRIVER™ gate drivers manage switching, and PSOC™ digital power controllers provide control functions. The MoU’s early-stage review process is intended to align component selection and reference designs before products are finalized. That kind of engagement can reduce integration risk for high-voltage power hardware, where topology, thermal design, isolation and control behavior must be validated together.
Product Portfolio and Market Context
SOLUM also presented an LVDC BBU DC/DC converter, an ORv3-compatible 33 kW power shelf and server PSUs. The portfolio therefore spans low-voltage DC backup conversion, rack-level power shelves and server power supplies, in addition to the 800 Vdc BBU converter. Generative AI and high-performance computing are driving data center power demand higher, making energy efficiency, power density and system reliability more important. HVDC-based power architectures are emerging as a key technology for next-generation AI data centers, reducing power losses and improving reliability through more efficient power conversion and distribution. The SOLUM-Infineon MoU is aimed at that transition, with 800 Vdc rack power architectures as a focal point.
Industry Impact and Supply-Chain Positioning
The partnership combines Infineon’s power semiconductor portfolio with SOLUM’s server power design and manufacturing capabilities. SOLUM, founded in 2015 as a spin-off from Samsung Electro-Mechanics and headquartered in Yongin, South Korea, operates manufacturing sites in Vietnam, Mexico, India and China, supported by a global sales and service network. That footprint could support pursuit of global customers, including opportunities in North America cited by SOLUM’s CEO. Infineon, which reported about 57,000 employees at the end of September 2025 and revenue of about €14.7 billion in its 2025 fiscal year, brings scale in power semiconductors and control solutions. The announcement did not disclose commercial terms, volumes or pricing, underscoring that the MoU is a technical and commercial framework rather than a disclosed supply commitment.
Implications for AI Data Centers
For AI data centers, power continuity and conversion efficiency are operational concerns, not just component-level specifications. A BBU DC/DC converter designed for 800 Vdc racks must support AI server operation during momentary power interruptions while fitting into a high-density power architecture. The targeted peak efficiency of more than 98.5% for the 26 kW-class converter, if achieved in production, would be important for reducing waste heat and preserving rack power budgets. The 2027 mass-production target indicates that the design is still in development, so operators should view the announcement as a roadmap signal rather than an available product.
Future Outlook
SOLUM and Infineon plan to continue their technical dialogue on next-generation developments. SOLUM’s CEO, Jun Sung-ho, said AI is driving fundamental changes not only in computing performance but also in the power infrastructure that supports it, and that working with Infineon will strengthen SOLUM’s high-voltage, high-efficiency power design capabilities and pursue new business opportunities in next-generation AI data center power markets, including North America. Adam White, Division President Power Systems at Infineon, said AI data centers require power infrastructure with increasingly higher levels of efficiency, reliability and power density, and that SOLUM’s server power capabilities complement Infineon’s semiconductor side. The collaboration’s progress will depend on how quickly 800 Vdc rack architectures are adopted and how the 26 kW-class BBU converter and related products move from showcase to mass production.