Overview

Infineon Technologies has introduced a high-voltage power distribution board reference design for AI data center power architectures operating at ±400V and 800VDC. The platform, described by Infineon as an HV PDB, integrates high-voltage protection, intermediate bus conversion, power regulation and telemetry management onto a single board. Its purpose is to let developers evaluate complete power delivery systems for next-generation AI server racks, at a time when AI workloads are pushing conventional AC power designs toward their limits and the industry is examining 800V DC distribution.

Board Architecture and Power Capacity

The HV PDB measures 480 × 125mm and supports output power of up to 12kW. Rather than a single converter block, the board combines several functional stages: input fuses, a dual hot-swap module, electromagnetic interference filtering, two 6kW high-voltage intermediate bus converter modules and two regulated 2.5kW IBC modules. This arrangement places protection, conversion and regulation on one evaluation platform, giving developers a way to study a full power chain rather than isolated components.

The board is designed around a high-voltage distribution role. It accepts high-voltage input, manages startup and fault conditions, converts to an intermediate bus, and then provides regulated downstream rails. The reference design can operate as a complete power conversion system or allow individual stages to be tested independently.

GaN Conversion and Mixed Semiconductor Technologies

The high-voltage conversion stage uses gallium nitride-based IBC modules to convert ±400V to 50V, with peak efficiency of up to 98.5%. Downstream regulated converters provide 48V-to-12V conversion. Across the platform, Infineon combines silicon, silicon carbide and GaN semiconductor technologies, matching each stage to the switching, isolation and regulation requirements of an 800VDC-oriented architecture.

The use of GaN in the high-voltage IBC stage is central to the board’s efficiency proposition. By converting from ±400V to 50V at high efficiency, the design seeks to reduce losses in the first conversion step before downstream regulation. The 48V-to-12V regulated stage then serves the lower-voltage rails needed by server electronics, while the intermediate bus architecture separates high-voltage distribution from point-of-load regulation.

Hot-Swap, Protection and Fault Evaluation

The integrated dual hot-swap module supports power levels of up to 32kW and provides controlled startup, fault isolation, telemetry monitoring and system protection. These functions are intended to let developers evaluate power distribution behavior under different operating and fault conditions. In a high-density AI rack, controlled startup and fault isolation are important because a fault in one branch should not propagate uncontrolled through the distribution path.

The board also includes input fuses and EMI filtering. Together with the hot-swap stage, these elements create a platform for examining startup sequences, fault behavior and overall system performance. Developers can observe how protection responds when a module is inserted, when a fault is applied or when the system transitions between operating states.

Telemetry and Board Management

System monitoring and energy management are handled by a dedicated board manager based on Infineon’s PSOC 3 microcontroller. The platform supports telemetry and PMBus connectivity for monitoring electrical parameters and coordinating power management functions. This management layer turns the HV PDB from a passive conversion board into an instrumented evaluation system, allowing electrical parameters to be observed and power management functions to be coordinated.

A PSOC evaluation board interface also supports custom firmware development. That interface gives developers room to adapt monitoring, control and telemetry behavior without replacing the underlying power stage.

Modular Evaluation and Design Flexibility

The HV PDB accommodates industry-standard half-brick high-voltage IBC modules and quarter-brick medium-voltage IBC modules with standardized pinouts. This modular architecture allows alternative, pin-compatible converter solutions to be evaluated within the same system. Developers can also evaluate alternative IBC modules, EMI filter configurations and power management approaches while analyzing startup sequences, fault behavior and overall system performance.

That flexibility matters for early-stage architecture work. A reference board with standardized footprints lets power designers compare converter choices and filter arrangements on a common platform, reducing the need to build a separate test vehicle for every configuration.

Market Context and Industry Impact

The introduction comes as AI workloads push conventional AC power designs to their limits. Higher-density AI racks increase the pressure on power distribution, conversion efficiency and thermal management. Infineon’s HV PDB targets the shift toward 800V DC distribution by providing a board-level reference for high-voltage protection, intermediate bus conversion, regulation and telemetry.

For the semiconductor industry, the design is also a demonstration of mixed technology integration. Silicon, SiC and GaN are combined on one platform, while GaN-based IBC modules address the high-voltage conversion step. The board therefore serves as both an evaluation tool and a signal of how power architectures for AI data centers may be assembled from specialized semiconductor technologies.

Implications for AI Data Centers

For AI data center power architects, the HV PDB offers a way to study a complete high-voltage distribution chain before committing to a production topology. The ability to test individual stages independently, swap pin-compatible IBC modules and examine fault behavior can shorten early evaluation. Telemetry and PMBus connectivity also support the monitoring and coordination functions that dense racks require.

The 12kW output and 32kW hot-swap capability define the board’s evaluation envelope, while the ±400V to 50V and 48V-to-12V conversion stages show how a high-voltage input can be translated into regulated lower-voltage rails. The design does not by itself define a data center standard, but it provides a concrete reference for developers working on 800VDC-oriented AI rack architectures.

Availability and Future Outlook

Infineon plans to make the HV PDB available in November 2026. The company will present the reference design at electronica 2026 in Munich, Germany, from November 10 to 13, at Hall C3, Booth 502. The reference design’s combination of high-voltage protection, GaN-based intermediate bus conversion, regulated output stages, hot-swap control and PSOC-based telemetry points to a continuing focus on board-level integration as AI data center power demands rise.